As a complement to the device manuals this entry gives you a summary of what to watch out for when connecting the equipotential bonding to the connection box of a mobile panel.
||Connection box PN Plus for Mobile Panel|
||Connection box PN Basic for Mobile Panel|
||Connection box DP Plus for Mobile Panel|
||Connection box DP Basic for Mobile Panel|
||Connection box Basic for Mobile Panel 170|
||Connection box Plus for Mobile Panel 170|
The figure below shows the connection of the equipotential bonding to a connection box.
||PE connection to the connection box (terminal strip 1, pin 1)|
||Equipotential bonding conductor with cross-section of 2.5 mm²|
||Equipotential bonding conductor with cross-section of 16 mm²|
||Equipotential bus bar|
||Parallel laying of equipotential bonding conductor and data cable (PROFIBUS, PROFINET)|
The following points are to be noted regarding equipotential bonding:
- The effectiveness of equipotential bonding is greater the less the impedance of the equipotential bonding conductor.
- If shielded signal cables that are connected on both sides with the grounding electrode/equipment grounding conductor are to be laid between the plant sections concerned, then the impedance of the additionally laid equipotential bonding conductor must not be more than 10% of the shield impedance.
- The cross-section of the equipotential bonding conductor must be adequate for the maximum compensating current. The following cross-sections have proven well in practice:
- 16 mm² CU for equipotential bonding conductors up to a length of 200m.
- 25 mm² CU for equipotential bonding conductors over a length of 200m.
- Use equipotential bonding conductors made of copper or galvanized steel. Equipotential bonding conductors are to be wide-area connected with the grounding electrode/equipment grounding conductor and protected against corrosion.
- The equipotential bonding conductor must be laid so that the surfaces between equipotential bonding conductor and the data cable are as small as possible.
- Clamp the shielding of the data cable over a large area and close to the equipotential bonding conductor with appropriate cable clamps.
More guidelines for the equipotential bonding are described in the "Guidelines for interference-immune installation of programmable logic controllers" in Entry ID 1064706 and the "SIMATIC NET PROFIBUS Network Manual" in Entry ID 35222591.
Connection box, Shielding, Ground, Shield, EMC, Electromagnetic compatibility, Faults, Fault current